Case Studies

Background:

During a Design for Manufacturing (DFM) review, our engineering team identified a potential issue in the customer’s PCB layout-several signal vias were positioned too close to SMD pads, leaving insufficient solder mask dam between them.

Challenge:

The lack of spacing posed a significant risk of solder bridging during reflow soldering. This could result in electrical shorts, solder wicking into the vias, poor joint integrity, and increased rework during production.

Our Approach:

We analyzed the layout and recommended the following:

• Relocate vias to allow sufficient space for solder mask dams.
• Where relocation wasn’t feasible, tent or plug the vias to isolate them.
• Follow IPC-7351B standards for spacing between vias and pads.

Solution & Outcome:

The customer implemented the changes by tenting or repositioning the vias and optimizing solder mask coverage. As a result:

• No solder bridging occurred during assembly.
• Component alignment and soldering quality improved.
• Rework and inspection time were significantly reduced.

Conclusion:

Our DFM intervention helped prevent a potential assembly defect, ensured product reliability, and optimized the customer's manufacturing process from the start.