Case Studies

Background:

During a DFM review of a customer’s PCB assembly, our team identified that the hole diameter for a single-row header was large compared to the pin size, risking misalignment during soldering.

Challenge:

The oversized holes posed a risk during the assembly process. Due to the loose mechanical fit:

• The header could easily become misaligned or tilted after soldering.
• This misalignment could result in connectivity issues, unreliable mating with connectors, and poor mechanical durability.

Our Approach:

• We conducted a DFM review and simulation of the assembly process to verify the risk.
• We promptly communicated our findings to the customer along with a clear recommendation to revise the PCB layout.
• We suggested resizing the plated through-hole (PTH) diameters to align with the standard tolerance for the specific header component being used.

Solution & Outcome:

The customer reviewed our feedback and agreed to implement the recommended changes. After updating the PCB layout:

• The new hole sizes provided a secure and accurate fit for the header pins.
• Post assembly inspection confirmed that the headers were perfectly aligned and mechanically stable.
• The customer appreciated our proactive input, which helped them avoid rework and quality issues downstream.

Conclusion:

This case demonstrates the importance of early engineering collaboration in avoiding assembly challenges. By identifying a minor design flaw that could have led to major reliability concerns, we helped the customer ensure product quality and maintain manufacturing efficiency.